BH GSO IEC 62047-16:2022
IEC 62047-16:2015
Bahraini Standard
Current Edition
·
Approved on
28 April 2022
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
BH GSO IEC 62047-16:2022 Files
English
21 Pages
Current Edition
Reference Language
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BH GSO IEC 62047-16:2022 Scope
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
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