BH GSO IEC 60749-22:2016
IEC 60749-22:2002
Bahraini Standard
Current Edition
·
Approved on
08 February 2016
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
BH GSO IEC 60749-22:2016 Files
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BH GSO IEC 60749-22:2016 Scope
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits).
The object of this part is to measure bond strength or determine compliance with specified bond strength requirements.
NOTE This test is identical to the test method contained in clause 6 of chapter 2 of IEC 60749 (1996), amendment 1, apart from changes to this clause and renumbering
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