All packaged semiconductor components, thin film circuits, surface acoustic wave (SAW) components, opto-electronic components, hybrid integrated circuits (HICS), and multi-chip modules (MCMs) >containing any of these components are to be evaluated according to this standard. The test methods described in this standard may also be used to evaluate components that are shipped as wafers or bare chips. To perform the tests, the components must be assembled into a package similar to that expected in the final application. The package used shall be recorded.