This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or cross linking. This standard does not relate to reactive compounds used as coating powders. NOTE – It is intended to draw up specifications for coating powders as a separate IEC Standard having a different number. These materials may be used for a range of applications, of which common ones are shown in table 1.