BH GSO IEC 60191-6-2:2016
IEC 60191-6-2:2001
Bahraini Standard
Current Edition
·
Approved on
10 February 2016
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
BH GSO IEC 60191-6-2:2016 Files
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BH GSO IEC 60191-6-2:2016 Scope
This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
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