BH GSO IEC 61189-3-719:2022
IEC 61189-3-719:2016
Bahraini Standard
Current Edition
·
Approved on
28 April 2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
BH GSO IEC 61189-3-719:2022 Files
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BH GSO IEC 61189-3-719:2022 Scope
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
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