BH GSO IEC 61189-3-719:2022

IEC 61189-3-719:2016
Bahraini Standard   Current Edition · Approved on 28 April 2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

BH GSO IEC 61189-3-719:2022 Files

English 22 Pages
Current Edition Reference Language

BH GSO IEC 61189-3-719:2022 Scope

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

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