BH GSO IEC 62047-18:2022
IEC 62047-18:2013
Bahraini Standard
Current Edition
·
Approved on
28 April 2022
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
BH GSO IEC 62047-18:2022 Files
English
26 Pages
Current Edition
Reference Language
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BH GSO IEC 62047-18:2022 Scope
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
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