BH GSO IEC 62047-25:2022
IEC 62047-25:2016
Bahraini Standard
Current Edition
·
Approved on
28 April 2022
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
BH GSO IEC 62047-25:2022 Files
English
45 Pages
Current Edition
Reference Language
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BH GSO IEC 62047-25:2022 Scope
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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