BH GSO IEC 61189-5-3:2022
IEC 61189-5-3:2015
Bahraini Standard
Current Edition
·
Approved on
28 April 2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
BH GSO IEC 61189-5-3:2022 Files
English
79 Pages
Current Edition
Reference Language
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BH GSO IEC 61189-5-3:2022 Scope
IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.
This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.
This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.
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