1.1 This practice covers the installation of self-leveling underlayments, which may include a priming system, over solid wood, wood structural panel subfloors, over concrete, and over certain solidly bonded existing flooring systems such as epoxy floors, ceramic and natural stone tiles, terrazzo, metal subfloors and foils such as steel, copper and lead, solidly bonded patching and other leveling materials as well as properly prepared non water-soluble adhesive residues as recommended by the underlayment manufacturer. This practice also covers the preparation of the self-leveling underlayment’s surface prior to the installation of resilient flooring. 1.2 This practice points out the factors that are required to be controlled while installing a self-leveling underlayment to be used as a substrate for resilient flooring. 1.3 This practice does not cover the structural adequacy of the subfloor. The structural integrity of assemblies is governed by local building codes and may be superseded by the resilient flooring manufacturer’s and the self-leveling underlayment manufacturer’s requirements.