ISO 9453:2020
International Standard
Current Edition
·
Approved on
24 September 2020
Soft solder alloys — Chemical compositions and forms
ISO 9453:2020 Files
English
13 Pages
Current Edition
40.4 BHD
ISO 9453:2020 Scope
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
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